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{
"id": 307477,
"description_type": {
"id": 5,
"name": "Source Catalog Curriculum"
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"description": "<h1>Program Prerequisites</h1><ol> <li> <p><strong>Academic Background:</strong></p> <ul> <li> <p>A bachelor's degree in a STEM field such as Electrical Engineering, Materials Science, Mechanical Engineering, Physics, or a closely related discipline.</p> </li> <li> <p>Minimum GPA of 3.0 on a 4.0 scale in undergraduate coursework.</p> </li> </ul> </li> <li> <p><strong>Fundamental Knowledge Required:</strong></p> <ul> <li> <p>Prior coursework or demonstrated competence in the following areas:</p> <ul> <li> <p>Circuit analysis and electronic devices (e.g., diodes, MOSFETs, BJTs)</p> </li> <li> <p>Basic materials science or semiconductor physics</p> </li> <li> <p>Probability and statistics for engineering applications</p> </li> </ul> </li> </ul> </li> <li> <p><strong>Additional Expectations:</strong></p> <ul> <li> <p>Students without prior exposure to semiconductor or reliability topics may be advised to take <b>EEE3350 (Semiconductor Devices)</b>, or <strong>EEE3307C (Electronics I)</strong> or <strong>EEE4344 (Fundamentals of Microelectronics)</strong> as background preparation.</p> </li> <li> <p>Professional engineers with relevant industry experience may petition to waive formal prerequisites with faculty approval.</p> </li> </ul> </li> </ol><h1>Degree Requirements</h1><div><section><header data-test=\"grouping-0-header\"><div><h2 data-testid=\"grouping-label\"><span></span></h2></div><div><span>12 - 14</span><span>Total Credits</span></div><div><div><button aria-label=\"Collapse\"><i></i></button></div></div></header><div><div><ul><li><span>Complete <!-- -->all<!-- --> of the following</span><ul><div><span class=\"rules_groupHeader_37\"></span><li><span>Complete <!-- -->all<!-- --> of the following</span><ul><li data-test=\"ruleView-A.1\"><div data-test=\"ruleView-A.1-result\">Complete at least <span>2</span> of the following: <div><ul style=\"margin-top:5px;margin-bottom:5px\"><li><span><a href=\"#/courses/view/60ca6b315a1583ea199e6cdc\" target=\"_blank\">EEE5352</a> <!-- -->-<!-- --> <!-- -->Semiconductor Material and Device Characterization<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li><li><span><a href=\"#/courses/view/60ca6b91a38edfebb83ec4fe\" target=\"_blank\">ESI5236</a> <!-- -->-<!-- --> <!-- -->Reliability Engineering<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li><li><span><a href=\"#/courses/view/60ca6b4ae6bc79f62973e552\" target=\"_blank\">EEL5245</a> <!-- -->-<!-- --> <!-- -->Power Electronics<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li><li><span><a href=\"#/courses/view/64fb65be7225dd115ef34dd9\" target=\"_blank\">EEE5416</a> <!-- -->-<!-- --> <!-- -->Radiation Effects and Reliability in Microelectronics<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li></ul></div></div></li><li data-test=\"ruleView-A.2\"><div data-test=\"ruleView-A.2-result\"><div>Students can also choose course: \nEEL 5937 - ST: Introduction to Space Electronics (3)</div></div></li></ul></li></div><li data-test=\"ruleView-B\"><div data-test=\"ruleView-B-result\">Complete at least <span>2</span> of the following: <div><ul style=\"margin-top:5px;margin-bottom:5px\"><li><span><a href=\"#/courses/view/60ca6b31a38edf89313ec3e5\" target=\"_blank\">EEE5323</a> <!-- -->-<!-- --> <!-- -->Radio Frequency Integrated Circuit Design<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li><li><span><a href=\"#/courses/view/60ca6b32e6bc7947aa73e535\" target=\"_blank\">EEE5353</a> <!-- -->-<!-- --> <!-- -->Semiconductor Device Modeling and Simulation<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li><li><span><a href=\"#/courses/view/60ca6b4aa38edf80893ec404\" target=\"_blank\">EEL5659</a> <!-- -->-<!-- --> <!-- -->Introduction to Sensors<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li><li><span><a href=\"#/courses/view/60ca6b4ae6bc79371b73e554\" target=\"_blank\">EEL5439C</a> <!-- -->-<!-- --> <!-- -->RF and Microwave Active Circuits<!-- --> <span style=\"margin-left:5px\">(4)</span></span></li><li><span><a href=\"#/courses/view/60ca6b4a00f82712b7140e82\" target=\"_blank\">EEL5722C</a> <!-- -->-<!-- --> <!-- -->Field-Programmable Gate Array (FPGA) Design<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li><li><span><a href=\"#/courses/view/60ca6b616b6b627e2d400167\" target=\"_blank\">EMA5415</a> <!-- -->-<!-- --> <!-- -->Electronic Principles of Materials Properties<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li><li><span><a href=\"#/courses/view/60ca6b31a8d2fb15462d8157\" target=\"_blank\">EEE5356C</a> <!-- -->-<!-- --> <!-- -->Fabrication of Solid-State Devices<!-- --> <span style=\"margin-left:5px\">(4)</span></span></li><li><span><a href=\"#/courses/view/60ca6b9100f8277412140f07\" target=\"_blank\">ESI5219</a> <!-- -->-<!-- --> <!-- -->Engineering Statistics<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li><li><span><a href=\"#/courses/view/60ca6b46714b5f049c5220d9\" target=\"_blank\">EEE6326C</a> <!-- -->-<!-- --> <!-- -->MEMS Fabrication Laboratory<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li><li><span><a href=\"#/courses/view/60ca6b3300f8279571140e6c\" target=\"_blank\">EEE6317</a> <!-- -->-<!-- --> <!-- -->Power Semiconductor Devices and Integrated Circuits<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li><li><span><a href=\"#/courses/view/60ca6b31a38edf85743ec3e3\" target=\"_blank\">EEE5332C</a> <!-- -->-<!-- --> <!-- -->Thin Film Technology<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li><li><span><a href=\"#/courses/view/60ca6b66a8d2fb40632d81b8\" target=\"_blank\">EML6233</a> <!-- -->-<!-- --> <!-- -->Fundamentals of Fatigue Analysis<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li><li><span><a href=\"#/courses/view/60ca6b46a38edf77203ec3f8\" target=\"_blank\">EEE6338</a> <!-- -->-<!-- --> <!-- -->Advanced Topics in Microelectronics<!-- --> <span style=\"margin-left:5px\">(3)</span></span></li></ul></div></div></li></ul></li></ul></div></div></section><h3>Grand Total Credits:<!-- --> <strong>12 - 14</strong></h3></div><h1>Financial Information</h1><p>Graduate students may receive financial assistance through fellowships, assistantships, tuition support, or loans. For more information, see the College of Graduate Studies <a href=\"https://graduate.ucf.edu/funding/\" target=\"_blank\">Funding website</a>, which describes the types of financial assistance available at UCF and provides general guidance in planning your graduate finances. The Financial Information section of the Graduate Catalog is another key resource.</p> <p><strong>UCF Student Financial Assistance</strong><br />Millican Hall 120<br />Telephone: 407-823-2827<br />Appointment Line: 407-823-5285<br />Fax: 407-823-5241<br /><a href=\"mailto:finaid@ucf.edu\">finaid@ucf.edu</a><br /><a href=\"http://finaid.ucf.edu/\" target=\"_blank\">Website</a></p><h1>Fellowship Information</h1><p>Fellowships are awarded based on academic merit to highly qualified students. They are paid to students through the Office of Student Financial Assistance, based on instructions provided by the College of Graduate Studies. Fellowships are given to support a student's graduate study and do not have a work obligation. For more information, see <a href=\"https://graduate.ucf.edu/fellowships/\" target=\"_blank\">UCF Graduate Fellowships</a>, which includes descriptions of university fellowships and what you should do to be considered for a fellowship.</p> <p><strong>Grad Fellowships</strong><br />Telephone: 407-823-0127<br /><a href=\"mailto:gradfellowship@ucf.edu\">gradfellowship@ucf.edu</a><br /><a href=\"https://funding.graduate.ucf.edu/\" target=\"_blank\">Website</a></p> <ul> <li>Opportunities for internships in NASA, DOD labs and industrial partners.</li> <li>Potential scholarships and awards.</li> </ul><p><strong>Program Description</strong></p> <p>The Electronic Parts Engineering Graduate Certificate prepares graduate students and working professionals for careers in the evaluation, qualification, and assurance of electrical, electronic, and electromechanical (EEE) parts used in space, defense, and other high-reliability environments. The program was developed in partnership with NASA’s Electronic Parts and Packaging (NEPP) program and the Department of Defense Microelectronics Commons initiative to address critical national workforce needs in radiation-hardened microelectronics, reliability engineering, and materials assurance.</p> <p>Students gain advanced knowledge in device physics, radiation effects, packaging, and qualification standards (e.g., MIL-STD-883, NASA-STD-8739.10, and ECSS-Q-ST-60) and apply this knowledge through laboratory experiences and collaborative research with NASA centers, defense contractors, and industry partners.<br />The program supports Florida’s Space Coast industry ecosystem and national microelectronics workforce initiatives by producing engineers capable of bridging the gap between design, fabrication, and system qualification.</p> <br /> <p><strong>Program Objectives</strong></p> <p>Graduates of this program will be able to:</p> <ol> <li>Evaluate and model the performance and degradation of EEE parts under radiation, thermal, and electrical stress.</li> <li>Apply qualification and screening standards (NASA-STD-8739.10, MIL-STD-883, ECSS-Q-ST-60) in part selection and system assurance.</li> <li>Conduct materials, electrical, and reliability testing using advanced laboratory and simulation tools.</li> <li>Interface effectively with mission assurance, test, and design teams to ensure component reliability in critical applications.</li> <li>Contribute to the national and international workforce in high-reliability microelectronics and packaging engineering.</li> </ol> <p><strong>Program Structure</strong></p> <ul> <li>Course Requirement: Minimum of 2 core and 2 elective courses. Some elective courses may not be available online every semester.</li> <li> <p>Minimum Grade: B (3.0) or higher in all courses</p> </li> <li> <p>Delivery Mode: 100% online or hybrid</p> </li> <li> <p>Typical Completion Time: 2–3 semesters</p> </li> </ul> <p><strong>Learning Outcomes</strong></p> <p>Graduates of this program will be able to:</p> <ul> <li>Conduct materials and electrical characterization of EEE components.</li> <li>Analyze and interpret failure modes and testing data.</li> <li>Apply standards and best practices for parts procurement and qualification.</li> <li>Interface with manufacturers and mission assurance teams.</li> </ul> <p><strong>Internships and Research Opportunities</strong></p> <p>Students are encouraged to pursue internships and research experiences with NASA centers, DoD labs, and industry partners. Opportunities may be coordinated through faculty advisors and affiliated programs.</p>",
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