Program Description Detail

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{
    "id": 347297,
    "description_type": {
        "id": 2,
        "name": "Catalog Description"
    },
    "description": "<p>The Electronic Parts Reliability and Qualification (EPRQ) Track within the Master of Science in Electrical Engineering (MSEE) program prepares students for careers in radiation-hardened microelectronics, electronic parts assurance, and mission reliability across space, defense, and critical infrastructure sectors.</p><p>Developed in partnership with NASA’s Electronic Parts and Packaging (NEPP) Program, DoD SCALE, and the NSF Microelectronics Commons, the track equips students with advanced knowledge of semiconductor device physics, radiation effects, packaging, and reliability engineering. Coursework integrates government and industry qualification standards such as MIL-STD-883, NASA-STD-8739.10, and ECSS-Q-ST-60, providing direct alignment with mission assurance practices used by NASA, JPL, and the Department of Defense.</p><p>Students gain hands-on and analytical expertise in device modeling, failure analysis, and part qualification testing through coursework, simulation, and optional laboratory experiences in UCF’s Radiation Effects and Reliability Lab (RERL).</p><p>The program is delivered 100% online, with optional on-campus participation for students seeking laboratory exposure. Graduates will be prepared to lead efforts in microelectronics reliability, screening, and qualification to support the CHIPS Act workforce development goals and the nation’s growing need for resilient electronic systems.</p>",
    "primary": false,
    "program": 2151
}